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CHIPS for America issued two Notices of Intent (NOI) 鈥撀爋ne for the National Advanced Packaging Manufacturing Program and the other for the CHIPS Manufacturing USA Institute.

• The NAPMP NOI announces a competition for new R&D activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for packaging semiconductors.鈥疌HIPS for America anticipates awarding approximately $300 million in funding for multiple projects in substrates and substrate materials research.聽聽and the聽聽are available.

• The CHIPS Manufacturing USA NOI announces a competition to create the CHIPS Manufacturing USA Institute. CHIPS anticipates investing at least $200 million in the institute - the first institute to have a combined focus of digital twins and semiconductor manufacturing.

Please note, these NOIs are NOT notices of funding opportunities. The opportunity to apply for the funds detailed in these NOIs is upcoming.

Note for Canadian researchers: Organizations outside the United States may participate as members of a project team, as sub-recipients or contractors, subject to CHIPS R&D approval based on a written justification that the foreign partner鈥檚 involvement is essential to advancing program objectives, among other considerations.